TIEMF in unirradiated Cu cored MI cables: Microstructure

by Vila, R. and Hodgson, E. R.
Reference:
TIEMF in unirradiated Cu cored MI cables: Microstructure (Vila, R. and Hodgson, E. R.), In FUSION ENGINEERING AND DESIGN, volume 82, 2007.
Bibtex Entry:
@article{nr456,
	Author = {Vila, R. and Hodgson, E. R.},
	CL = {Warsaw, POLAND},
	CT = {24th Symposium on Fusion Technology (SOFT-24)},
	CY = {SEP 11-15, 2006},
	Date = {OCT 2007},
	Date-Added = {2013-10-12 14:28:31 +0000},
	Date-Modified = {2013-10-12 14:28:31 +0000},
	Doi = {10.1016/j.fusengdes.2006.12.004},
	Isi = {WOS:000250744500119},
	Issn = {0920-3796},
	Journal = {FUSION ENGINEERING AND DESIGN},
	Month = {Oct},
	Number = {5-14},
	Pages = {1271--1276},
	Publication-Type = {J},
	RI = {VILA, RAFAEL/C-5903-2011},
	Times-Cited = {7},
	Title = {TIEMF in unirradiated Cu cored MI cables: Microstructure},
	Volume = {82},
	Year = {2007},
	Z8 = {0},
	Z9 = {7},
	ZB = {0},
	ZS = {0},
	Bdsk-Url-1 = {http://dx.doi.org/10.1016/j.fusengdes.2006.12.004}}